A3P1000L-1FGG256Y
vs
A3P600L-1FG144Y
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
250 MHz
|
250 MHz
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B144
|
| JESD-609 Code |
e1
|
e0
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Inputs |
177
|
97
|
| Number of Logic Cells |
24576
|
13824
|
| Number of Outputs |
177
|
97
|
| Number of Terminals |
256
|
144
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA256,16X16,40
|
BGA144,12X12,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
250
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
3
|
3
|
| Package Description |
|
BGA, BGA144,12X12,40
|
|
|
|
Compare A3P1000L-1FGG256Y with alternatives
Compare A3P600L-1FG144Y with alternatives