A3P1000L-1FG144I vs A3P1000L-1FG144YI feature comparison

A3P1000L-1FG144I Microsemi Corporation

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A3P1000L-1FG144YI Microchip Technology Inc

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description LBGA, BGA144,12X12,40
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Microsemi Corporation
Clock Frequency-Max 350 MHz 250 MHz
JESD-30 Code S-PBGA-B144 S-PBGA-B144
JESD-609 Code e0 e0
Length 13 mm
Moisture Sensitivity Level 3 3
Number of CLBs 24576
Number of Equivalent Gates 1000000
Number of Inputs 97 97
Number of Logic Cells 24576 24576
Number of Outputs 97 97
Number of Terminals 144 144
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 24576 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA144,12X12,40 BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD SILVER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm
Base Number Matches 3 3

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