A3P1000-PQG208Y
vs
A3P1000-PQ208
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
QFP
|
|
Package Description |
FQFP,
|
|
Pin Count |
208
|
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
|
JESD-30 Code |
S-PQFP-G208
|
|
Length |
28 mm
|
|
Moisture Sensitivity Level |
3
|
|
Number of CLBs |
24576
|
|
Number of Equivalent Gates |
1000000
|
|
Number of Terminals |
208
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
|
|
Organization |
24576 CLBS, 1000000 GATES
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
FQFP
|
|
Package Shape |
SQUARE
|
|
Package Style |
FLATPACK, FINE PITCH
|
|
Peak Reflow Temperature (Cel) |
245
|
NOT SPECIFIED
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
4.1 mm
|
|
Supply Voltage-Max |
1.575 V
|
|
Supply Voltage-Min |
1.425 V
|
|
Supply Voltage-Nom |
1.5 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
COMMERCIAL
|
|
Terminal Form |
GULL WING
|
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
QUAD
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
28 mm
|
|
Base Number Matches |
3
|
3
|
|
|
|
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