A3P1000-PQG208 vs A3P1000-FG144I feature comparison

A3P1000-PQG208 Microsemi Corporation

Buy Now Datasheet

A3P1000-FG144I Microchip Technology Inc

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144
Reach Compliance Code compliant compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Microsemi Corporation Microchip
Clock Frequency-Max 350 MHz 350 MHz
JESD-30 Code S-PQFP-G208 S-PBGA-B144
JESD-609 Code e3 e0
Length 28 mm 13 mm
Moisture Sensitivity Level 3 3
Number of CLBs 24576 24576
Number of Equivalent Gates 1000000 1000000
Number of Terminals 208 144
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 24576 CLBS, 1000000 GATES 24576 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP LBGA
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 245 235
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.1 mm 1.55 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 20
Width 28 mm 13 mm
Base Number Matches 22 8
Factory Lead Time 4 Weeks
Number of Inputs 97
Number of Outputs 97
Package Equivalence Code BGA144,12X12,40
Packing Method TRAY

Compare A3P1000-PQG208 with alternatives

Compare A3P1000-FG144I with alternatives