A3P1000-FGG484Y vs A3P1000-FG484I feature comparison

A3P1000-FGG484Y Microsemi FPGA & SoC

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A3P1000-FG484I Actel Corporation

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI SOC PRODUCTS GROUP ACTEL CORP
Part Package Code BGA
Package Description BGA, 1 MM PITCH, FBGA-484
Pin Count 484
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e1
Length 23 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 24576
Number of Equivalent Gates 1000000 1000000
Number of Terminals 484 484
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 24576 CLBS, 1000000 GATES 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 23 mm 27 mm
Base Number Matches 3 3
Rohs Code No
Qualification Status Not Qualified

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