A3P1000-FGG256YC
vs
A3P1000-FGG256Y
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI SOC PRODUCTS GROUP
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-609 Code
e1
e1
Moisture Sensitivity Level
3
3
Peak Reflow Temperature (Cel)
250
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
30
30
Base Number Matches
3
3
Part Package Code
BGA
Package Description
LBGA,
Pin Count
256
JESD-30 Code
S-PBGA-B256
Length
17 mm
Number of CLBs
24576
Number of Equivalent Gates
1000000
Number of Terminals
256
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
24576 CLBS, 1000000 GATES
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
Seated Height-Max
1.7 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.425 V
Supply Voltage-Nom
1.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
17 mm
Compare A3P1000-FGG256YC with alternatives
Compare A3P1000-FGG256Y with alternatives