A3P1000-FGG256IY
vs
A3P1000-FGG256
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.D
|
3A991.D
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
Length |
1.7 mm
|
17 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
24576
|
24576
|
Number of Equivalent Gates |
1000000
|
1000000
|
Number of Inputs |
177
|
177
|
Number of Outputs |
177
|
177
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
100 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
24576 CLBS, 1000000 GATES
|
24576 CLBS, 1000000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
BGA
|
Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
250
|
250
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
1.7 mm
|
1.8 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
1
|
21
|
Package Description |
|
17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256
|
Clock Frequency-Max |
|
350 MHz
|
JESD-609 Code |
|
e1
|
Packing Method |
|
TRAY
|
Qualification Status |
|
Not Qualified
|
Temperature Grade |
|
COMMERCIAL
|
Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
Compare A3P1000-FGG256IY with alternatives
Compare A3P1000-FGG256 with alternatives