A3P1000-FG256YT
vs
A3P1000-1FGG484YI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI SOC PRODUCTS GROUP
MICROSEMI SOC PRODUCTS GROUP
Package Description
,
BGA,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-609 Code
e0
e1
Moisture Sensitivity Level
3
3
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Terminal Finish
TIN LEAD SILVER
Tin/Silver/Copper (Sn/Ag/Cu)
Base Number Matches
1
2
Part Package Code
BGA
Pin Count
484
JESD-30 Code
S-PBGA-B484
Length
23 mm
Number of CLBs
24576
Number of Equivalent Gates
1000000
Number of Terminals
484
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
24576 CLBS, 1000000 GATES
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY
Peak Reflow Temperature (Cel)
250
Seated Height-Max
2.44 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.425 V
Supply Voltage-Nom
1.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
23 mm
Compare A3P1000-FG256YT with alternatives
Compare A3P1000-1FGG484YI with alternatives