A3P1000-FG256YC
vs
A3P1000-FGG256I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.31.00.01
Clock Frequency-Max
350 MHz
350 MHz
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e1
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of Equivalent Gates
1000000
1000000
Number of Inputs
177
177
Number of Logic Cells
24576
Number of Outputs
177
177
Number of Terminals
256
256
Operating Temperature-Max
70 °C
100 °C
Operating Temperature-Min
-40 °C
Organization
1000000 GATES
24576 CLBS, 1000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
1.7 mm
1.8 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD SILVER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
17 mm
17 mm
Base Number Matches
1
7
Package Description
17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256
ECCN Code
3A991.D
Samacsys Manufacturer
Microchip
Number of CLBs
24576
Packing Method
TRAY
Peak Reflow Temperature (Cel)
250
Qualification Status
Not Qualified
Time@Peak Reflow Temperature-Max (s)
30
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