A3P1000-FG256I
vs
A3P1000-1FGG256YC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Package Description
BGA,
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Microsemi Corporation
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B256
JESD-609 Code
e0
e1
Length
17 mm
Moisture Sensitivity Level
3
3
Number of CLBs
24576
Number of Equivalent Gates
1000000
Number of Terminals
256
Operating Temperature-Max
100 °C
Operating Temperature-Min
-40 °C
Organization
24576 CLBS, 1000000 GATES
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
Package Style
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
1.8 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.425 V
Supply Voltage-Nom
1.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
17 mm
Base Number Matches
11
1
Peak Reflow Temperature (Cel)
250
Time@Peak Reflow Temperature-Max (s)
30
Compare A3P1000-FG256I with alternatives
Compare A3P1000-1FGG256YC with alternatives