A3P1000-2FG484IY
vs
A3P1000-2FGG484
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Base Number Matches |
2
|
3
|
Rohs Code |
|
Yes
|
Package Description |
|
23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484
|
Clock Frequency-Max |
|
350 MHz
|
JESD-30 Code |
|
S-PBGA-B484
|
JESD-609 Code |
|
e1
|
Length |
|
23 mm
|
Moisture Sensitivity Level |
|
3
|
Number of CLBs |
|
24576
|
Number of Equivalent Gates |
|
1000000
|
Number of Inputs |
|
177
|
Number of Outputs |
|
177
|
Number of Terminals |
|
484
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
|
24576 CLBS, 1000000 GATES
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
BGA
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY
|
Packing Method |
|
TRAY
|
Peak Reflow Temperature (Cel) |
|
250
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
2.44 mm
|
Supply Voltage-Max |
|
1.575 V
|
Supply Voltage-Min |
|
1.425 V
|
Supply Voltage-Nom |
|
1.5 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
COMMERCIAL
|
Terminal Finish |
|
TIN SILVER COPPER
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
1 mm
|
Terminal Position |
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
23 mm
|
|
|
|
Compare A3P1000-2FG484IY with alternatives
Compare A3P1000-2FGG484 with alternatives