A3P1000-2FG256YM
vs
A3P1000-2FG256I
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ACTEL CORP
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| JESD-609 Code |
e0
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Terminal Finish |
Tin/Lead/Silver (Sn/Pb/Ag)
|
|
| Base Number Matches |
2
|
3
|
| Package Description |
|
1 MM PITCH, FBGA-256
|
| JESD-30 Code |
|
S-PBGA-B256
|
| Length |
|
17 mm
|
| Number of Equivalent Gates |
|
1000000
|
| Number of Terminals |
|
256
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
1000000 GATES
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
BGA
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY
|
| Qualification Status |
|
Not Qualified
|
| Supply Voltage-Max |
|
1.575 V
|
| Supply Voltage-Min |
|
1.425 V
|
| Supply Voltage-Nom |
|
1.5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
17 mm
|
|
|
|
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