A3P1000-1PQG208Y
vs
A3P1000-1FGG484I
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
FQFP,
|
23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PQFP-G208
|
S-PBGA-B484
|
Length |
28 mm
|
23 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
24576
|
24576
|
Number of Equivalent Gates |
1000000
|
1000000
|
Number of Terminals |
208
|
484
|
Operating Temperature-Max |
85 °C
|
100 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
24576 CLBS, 1000000 GATES
|
24576 CLBS, 1000000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FQFP
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, FINE PITCH
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
245
|
250
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
4.1 mm
|
2.44 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.5 mm
|
1 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
28 mm
|
23 mm
|
Base Number Matches |
6
|
8
|
Samacsys Manufacturer |
|
Microchip
|
Clock Frequency-Max |
|
350 MHz
|
JESD-609 Code |
|
e1
|
Number of Inputs |
|
177
|
Number of Outputs |
|
177
|
Packing Method |
|
TRAY
|
Qualification Status |
|
Not Qualified
|
Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
Compare A3P1000-1PQG208Y with alternatives
Compare A3P1000-1FGG484I with alternatives