A3P1000-1PQG208I
vs
A3P1000-2FGG144I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
FQFP,
13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.31.00.01
Clock Frequency-Max
350 MHz
350 MHz
JESD-30 Code
S-PQFP-G208
S-PBGA-B144
JESD-609 Code
e3
e1
Length
28 mm
13 mm
Moisture Sensitivity Level
3
3
Number of CLBs
24576
24576
Number of Equivalent Gates
1000000
1000000
Number of Terminals
208
144
Operating Temperature-Max
100 °C
100 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
24576 CLBS, 1000000 GATES
24576 CLBS, 1000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FQFP
LBGA
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, FINE PITCH
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
245
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.1 mm
1.55 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
TIN SILVER COPPER
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
1 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
28 mm
13 mm
Base Number Matches
3
3
ECCN Code
EAR99
Number of Inputs
97
Number of Outputs
97
Package Equivalence Code
BGA144,12X12,40
Packing Method
TRAY
Compare A3P1000-1PQG208I with alternatives
Compare A3P1000-2FGG144I with alternatives