A3P1000-1PQ208YM vs A3P1000-2FGG484IY feature comparison

A3P1000-1PQ208YM Microchip Technology Inc

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A3P1000-2FGG484IY Microchip Technology Inc

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Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description 0.50 MM PITCH, PLASTIC, QFP-208
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G208 S-PBGA-B484
Length 28 mm 23 mm
Number of CLBs 24576 24576
Number of Equivalent Gates 1000000 1000000
Number of Inputs 154 300
Number of Logic Cells 24576
Number of Outputs 154 300
Number of Terminals 208 484
Operating Temperature-Max 125 °C 100 °C
Operating Temperature-Min -55 °C -40 °C
Organization 24576 CLBS, 1000000 GATES 24576 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP BGA
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 4.1 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.14 V 1.425 V
Supply Voltage-Nom 1.2 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position QUAD BOTTOM
Width 28 mm 23 mm
Base Number Matches 2 2
Rohs Code Yes
Moisture Sensitivity Level 3
Package Equivalence Code BGA484,22X22,40
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30

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