A3P1000-1PQ208YI vs A3P1000-1PQG208 feature comparison

A3P1000-1PQ208YI Microsemi FPGA & SoC

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A3P1000-1PQG208 Microchip Technology Inc

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Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI SOC PRODUCTS GROUP MICROCHIP TECHNOLOGY INC
Part Package Code QFP
Package Description FQFP, 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208
Pin Count 208
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.31.00.01
JESD-30 Code S-PQFP-G208 S-PQFP-G208
Length 28 mm 28 mm
Number of CLBs 24576 24576
Number of Equivalent Gates 1000000 1000000
Number of Terminals 208 208
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 24576 CLBS, 1000000 GATES 24576 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP FQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH FLATPACK, FINE PITCH
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 4.1 mm 4.1 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 28 mm 28 mm
Base Number Matches 2 16
Rohs Code Yes
ECCN Code EAR99
Clock Frequency-Max 350 MHz
JESD-609 Code e3
Moisture Sensitivity Level 3
Packing Method TRAY
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 30

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