A3P1000-1PQ208 vs A3P1000-1PQG208YI feature comparison

A3P1000-1PQ208 Microchip Technology Inc

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A3P1000-1PQG208YI Microsemi Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Reach Compliance Code unknown unknown
Clock Frequency-Max 350 MHz
JESD-30 Code S-PQFP-G208 S-PQFP-G208
JESD-609 Code e0
Length 28 mm 28 mm
Number of CLBs 24576 24576
Number of Equivalent Gates 1000000 1000000
Number of Inputs 154
Number of Outputs 154
Number of Terminals 208 208
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 24576 CLBS, 1000000 GATES 24576 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP FQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 4.1 mm 4.1 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 28 mm 28 mm
Base Number Matches 13 2
Package Description FQFP,
HTS Code 8542.39.00.01
Moisture Sensitivity Level 3

Compare A3P1000-1PQ208 with alternatives

Compare A3P1000-1PQG208YI with alternatives