A3P1000-1PQ208
vs
A3P1000-1PQG208YI
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Reach Compliance Code
unknown
unknown
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PQFP-G208
S-PQFP-G208
JESD-609 Code
e0
Length
28 mm
28 mm
Number of CLBs
24576
24576
Number of Equivalent Gates
1000000
1000000
Number of Inputs
154
Number of Outputs
154
Number of Terminals
208
208
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
24576 CLBS, 1000000 GATES
24576 CLBS, 1000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FQFP
FQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, FINE PITCH
FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
4.1 mm
4.1 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
28 mm
28 mm
Base Number Matches
13
2
Package Description
FQFP,
HTS Code
8542.39.00.01
Moisture Sensitivity Level
3
Compare A3P1000-1PQ208 with alternatives
Compare A3P1000-1PQG208YI with alternatives