A3P1000-1FGG484Y
vs
A3P1000-1FG256YT
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROSEMI CORP
|
Part Package Code |
BGA
|
|
Package Description |
BGA,
|
,
|
Pin Count |
484
|
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B484
|
|
JESD-609 Code |
e1
|
e0
|
Length |
23 mm
|
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
24576
|
|
Number of Equivalent Gates |
1000000
|
|
Number of Terminals |
484
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
|
|
Organization |
24576 CLBS, 1000000 GATES
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
BGA
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY
|
|
Peak Reflow Temperature (Cel) |
250
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
2.44 mm
|
|
Supply Voltage-Max |
1.575 V
|
|
Supply Voltage-Min |
1.425 V
|
|
Supply Voltage-Nom |
1.5 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
COMMERCIAL
|
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN LEAD SILVER
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
23 mm
|
|
Base Number Matches |
6
|
1
|
Rohs Code |
|
No
|
|
|
|
Compare A3P1000-1FGG484Y with alternatives
Compare A3P1000-1FG256YT with alternatives