A3P1000-1FGG256II vs A3P1000-FG144I feature comparison

A3P1000-1FGG256II Microsemi Corporation

Buy Now Datasheet

A3P1000-FG144I Microchip Technology Inc

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP MICROCHIP TECHNOLOGY INC
Package Description BGA, 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 350 MHz 350 MHz
JESD-30 Code S-PBGA-B256 S-PBGA-B144
Length 17 mm 13 mm
Moisture Sensitivity Level 3 3
Number of CLBs 24576 24576
Number of Equivalent Gates 1000000 1000000
Number of Terminals 256 144
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 24576 CLBS, 1000000 GATES 24576 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 250 235
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.8 mm 1.55 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 20
Width 17 mm 13 mm
Base Number Matches 3 8
Factory Lead Time 4 Weeks
Samacsys Manufacturer Microchip
JESD-609 Code e0
Number of Inputs 97
Number of Outputs 97
Packing Method TRAY
Terminal Finish TIN LEAD

Compare A3P1000-1FGG256II with alternatives

Compare A3P1000-FG144I with alternatives