A3P1000-1FGG144YC vs A3P1000-1FGG144T feature comparison

A3P1000-1FGG144YC Microchip Technology Inc

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A3P1000-1FGG144T Microsemi Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 350 MHz 350 MHz
JESD-30 Code S-PBGA-B144 S-PBGA-B144
JESD-609 Code e1 e1
Length 13 mm 13 mm
Moisture Sensitivity Level 3 3
Number of Equivalent Gates 1000000 1000000
Number of Inputs 97 97
Number of Logic Cells 24576 24576
Number of Outputs 97 97
Number of Terminals 144 144
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -40 °C
Organization 1000000 GATES 24576 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA144,12X12,40 BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 1.55 mm 1.55 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL AUTOMOTIVE
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 13 mm 13 mm
Base Number Matches 1 1
Package Description LBGA, BGA144,12X12,40
Samacsys Manufacturer Microsemi Corporation
Number of CLBs 24576
Qualification Status Not Qualified
Screening Level AEC-Q100

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