A3P1000-1FG484II
vs
A3P1000-1FGG484YM
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484
|
FPBGA-144
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
350 MHz
|
|
JESD-30 Code |
S-PBGA-B484
|
|
Length |
23 mm
|
|
Number of CLBs |
24576
|
|
Number of Equivalent Gates |
1000000
|
|
Number of Inputs |
300
|
|
Number of Outputs |
300
|
|
Number of Terminals |
484
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
24576 CLBS, 1000000 GATES
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
BGA
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
2.44 mm
|
|
Supply Voltage-Max |
1.575 V
|
|
Supply Voltage-Min |
1.425 V
|
|
Supply Voltage-Nom |
1.5 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
|
Width |
23 mm
|
|
Base Number Matches |
3
|
2
|
Rohs Code |
|
Yes
|
ECCN Code |
|
3A001.A.2.C
|
JESD-609 Code |
|
e1
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
250
|
Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare A3P1000-1FG484II with alternatives
Compare A3P1000-1FGG484YM with alternatives