A3P1000-1FG484I
vs
A3P1000-PQ208YM
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI SOC PRODUCTS GROUP
Package Description
BGA,
FQFP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Microsemi Corporation
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B484
S-PQFP-G208
JESD-609 Code
e0
Length
23 mm
28 mm
Number of CLBs
24576
24576
Number of Equivalent Gates
1000000
1000000
Number of Terminals
484
208
Operating Temperature-Max
100 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
24576 CLBS, 1000000 GATES
24576 CLBS, 1000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
FQFP
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK, FINE PITCH
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
2.44 mm
4.1 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.14 V
Supply Voltage-Nom
1.5 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Width
23 mm
28 mm
Base Number Matches
11
2
Part Package Code
QFP
Pin Count
208
ECCN Code
3A001.A.2.C
Compare A3P1000-1FG484I with alternatives
Compare A3P1000-PQ208YM with alternatives