A3P1000-1FG484C
vs
A3P1000-1FG484YM
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
1 MM PITCH, FBGA-484
FPBGA-144
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
350 MHz
250 MHz
JESD-30 Code
S-PBGA-B484
S-PBGA-B144
JESD-609 Code
e0
e0
Length
27 mm
13 mm
Moisture Sensitivity Level
3
3
Number of Equivalent Gates
1000000
1000000
Number of Inputs
300
154
Number of Logic Cells
24576
24576
Number of Outputs
300
154
Number of Terminals
484
144
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
1000000 GATES
1000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA484,22X22,40
BGA144,12X12,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
2.44 mm
1.55 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
13 mm
Base Number Matches
1
2
ECCN Code
3A001.A.2.C
Compare A3P1000-1FG484C with alternatives
Compare A3P1000-1FG484YM with alternatives