A3P1000-1FG484C vs A3P1000-1FG484YM feature comparison

A3P1000-1FG484C Microchip Technology Inc

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A3P1000-1FG484YM Microsemi Corporation

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Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description 1 MM PITCH, FBGA-484 FPBGA-144
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 350 MHz 250 MHz
JESD-30 Code S-PBGA-B484 S-PBGA-B144
JESD-609 Code e0 e0
Length 27 mm 13 mm
Moisture Sensitivity Level 3 3
Number of Equivalent Gates 1000000 1000000
Number of Inputs 300 154
Number of Logic Cells 24576 24576
Number of Outputs 300 154
Number of Terminals 484 144
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 1000000 GATES 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA484,22X22,40 BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.44 mm 1.55 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 13 mm
Base Number Matches 1 2
ECCN Code 3A001.A.2.C

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