A3P1000-1FG144YM
vs
A3P1000-PQG208Y
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI SOC PRODUCTS GROUP
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-609 Code |
e0
|
|
Moisture Sensitivity Level |
3
|
3
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Terminal Finish |
Tin/Lead/Silver (Sn/Pb/Ag)
|
|
Base Number Matches |
2
|
6
|
Part Package Code |
|
QFP
|
Package Description |
|
FQFP,
|
Pin Count |
|
208
|
JESD-30 Code |
|
S-PQFP-G208
|
Length |
|
28 mm
|
Number of CLBs |
|
24576
|
Number of Equivalent Gates |
|
1000000
|
Number of Terminals |
|
208
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
|
24576 CLBS, 1000000 GATES
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
FQFP
|
Package Shape |
|
SQUARE
|
Package Style |
|
FLATPACK, FINE PITCH
|
Peak Reflow Temperature (Cel) |
|
245
|
Seated Height-Max |
|
4.1 mm
|
Supply Voltage-Max |
|
1.575 V
|
Supply Voltage-Min |
|
1.425 V
|
Supply Voltage-Nom |
|
1.5 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
COMMERCIAL
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
0.5 mm
|
Terminal Position |
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
28 mm
|
|
|
|
Compare A3P1000-1FG144YM with alternatives
Compare A3P1000-PQG208Y with alternatives