A3P1000-1FG144 vs A3P1000-1FG144YM feature comparison

A3P1000-1FG144 Microsemi Corporation

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A3P1000-1FG144YM Microsemi FPGA & SoC

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI CORP MICROSEMI SOC PRODUCTS GROUP
Package Description LBGA, LBGA,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Clock Frequency-Max 350 MHz
JESD-30 Code S-PBGA-B144 S-PBGA-B144
JESD-609 Code e0
Length 13 mm 13 mm
Moisture Sensitivity Level 3
Number of CLBs 24576 24576
Number of Equivalent Gates 1000000 1000000
Number of Terminals 144 144
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -55 °C
Organization 24576 CLBS, 1000000 GATES 24576 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 1.55 mm 1.55 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.14 V
Supply Voltage-Nom 1.5 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD SILVER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 13 mm
Base Number Matches 3 3
Part Package Code BGA
Pin Count 144

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