A3P060-QNG132YI
vs
A3P060-1FG144YI
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROSEMI SOC PRODUCTS GROUP
|
| Part Package Code |
QFP
|
BGA
|
| Package Description |
QCCN,
|
LBGA,
|
| Pin Count |
132
|
144
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-XQCC-N132
|
S-PBGA-B144
|
| Length |
8 mm
|
13 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
1536
|
1536
|
| Number of Equivalent Gates |
60000
|
60000
|
| Number of Terminals |
132
|
144
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
1536 CLBS, 60000 GATES
|
1536 CLBS, 60000 GATES
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
QCCN
|
LBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
GRID ARRAY, LOW PROFILE
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
1 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
8 mm
|
13 mm
|
| Base Number Matches |
2
|
3
|
| JESD-609 Code |
|
e0
|
| Seated Height-Max |
|
1.55 mm
|
| Terminal Finish |
|
TIN LEAD SILVER
|
|
|
|
Compare A3P060-QNG132YI with alternatives
Compare A3P060-1FG144YI with alternatives