A3P060-QNG132IY vs A3P060-QN132 feature comparison

A3P060-QNG132IY Microsemi Corporation

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A3P060-QN132 Microsemi Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description , 8 X 8 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, QFN-132
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2016-03-25
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Base Number Matches 1 2
Rohs Code No
Clock Frequency-Max 350 MHz
JESD-30 Code S-XBCC-B132
Length 8 mm
Number of CLBs 1536
Number of Equivalent Gates 60000
Number of Terminals 132
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 1536 CLBS, 60000 GATES
Package Body Material UNSPECIFIED
Package Code HVBCC
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 235
Qualification Status Not Qualified
Seated Height-Max 0.8 mm
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
Supply Voltage-Nom 1.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form BUTT
Terminal Pitch 0.5 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 8 mm

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Compare A3P060-QN132 with alternatives