A3P060-QNG132II vs A3P060-QN132 feature comparison

A3P060-QNG132II Microsemi Corporation

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A3P060-QN132 Microsemi Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description VBCC, 8 X 8 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, QFN-132
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 350 MHz 350 MHz
JESD-30 Code S-XBCC-B132 S-XBCC-B132
Length 8 mm 8 mm
Number of CLBs 1536 1536
Number of Equivalent Gates 60000 60000
Number of Inputs 80
Number of Outputs 80
Number of Terminals 132 132
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1536 CLBS, 60000 GATES 1536 CLBS, 60000 GATES
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code VBCC HVBCC
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.8 mm 0.8 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BUTT BUTT
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 1 6
Rohs Code No
Peak Reflow Temperature (Cel) 235
Time@Peak Reflow Temperature-Max (s) 20

Compare A3P060-QNG132II with alternatives

Compare A3P060-QN132 with alternatives