A3P060-QNG132I
vs
A3P060-2FGG144IY
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
8 X 8 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, GREEN, QFN-132
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-XBCC-B132
|
|
Length |
8 mm
|
|
Moisture Sensitivity Level |
2
|
3
|
Number of CLBs |
1536
|
|
Number of Equivalent Gates |
60000
|
|
Number of Inputs |
80
|
|
Number of Outputs |
80
|
|
Number of Terminals |
132
|
|
Operating Temperature-Max |
100 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
1536 CLBS, 60000 GATES
|
|
Package Body Material |
UNSPECIFIED
|
|
Package Code |
HVBCC
|
|
Package Shape |
SQUARE
|
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
0.8 mm
|
|
Supply Voltage-Max |
1.575 V
|
|
Supply Voltage-Min |
1.425 V
|
|
Supply Voltage-Nom |
1.5 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Form |
BUTT
|
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
8 mm
|
|
Base Number Matches |
2
|
2
|
|
|
|
Compare A3P060-QNG132I with alternatives
Compare A3P060-2FGG144IY with alternatives