A3P060-FG144YC
vs
A3P060-FGG144
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
350 MHz
350 MHz
JESD-30 Code
S-PBGA-B144
S-PBGA-B144
JESD-609 Code
e0
e1
Length
13 mm
13 mm
Moisture Sensitivity Level
3
3
Number of Equivalent Gates
60000
60000
Number of Inputs
96
96
Number of Logic Cells
1536
Number of Outputs
96
96
Number of Terminals
144
144
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
Organization
60000 GATES
1536 CLBS, 60000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA144,12X12,40
BGA144,12X12,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
1.55 mm
1.55 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD SILVER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
13 mm
Base Number Matches
3
3
Package Description
13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144
Factory Lead Time
8 Weeks
Number of CLBs
1536
Packing Method
TRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Time@Peak Reflow Temperature-Max (s)
30
Compare A3P060-FG144YC with alternatives
Compare A3P060-FGG144 with alternatives