A3P060-FG144T vs A3P060-FGG144C feature comparison

A3P060-FG144T Microchip Technology Inc

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A3P060-FGG144C Microsemi Corporation

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Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description 1 MM PITCH, FBGA-144 LBGA,
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 18 Weeks
Clock Frequency-Max 350 MHz 350 MHz
JESD-30 Code S-PBGA-B144 S-PBGA-B144
JESD-609 Code e0 e1
Length 13 mm 13 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1536 1536
Number of Equivalent Gates 60000 60000
Number of Inputs 96
Number of Logic Cells 1536
Number of Outputs 96
Number of Terminals 144 144
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1536 CLBS, 60000 GATES 1536 CLBS, 60000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA144,12X12,40 BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Packing Method TRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Screening Level AEC-Q100
Seated Height-Max 1.55 mm 1.55 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE COMMERCIAL
Terminal Finish TIN LEAD SILVER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 13 mm
Base Number Matches 3 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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