A3P060-2TQG144YI
vs
A3P060-2CS121Y
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI SOC PRODUCTS GROUP
MICROSEMI CORP
Part Package Code
QFP
Package Description
LFQFP,
VFBGA,
Pin Count
144
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PQFP-G144
S-PBGA-B121
Length
20 mm
6 mm
Moisture Sensitivity Level
3
Number of CLBs
1536
1536
Number of Equivalent Gates
60000
60000
Number of Terminals
144
121
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1536 CLBS, 60000 GATES
1536 CLBS, 60000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
VFBGA
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
1.6 mm
0.99 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
BOTTOM
Width
20 mm
6 mm
Base Number Matches
3
3
Rohs Code
No
Package Equivalence Code
BGA121,11X11,20
Compare A3P060-2TQG144YI with alternatives
Compare A3P060-2CS121Y with alternatives