A3P060-2TQG144YI vs A3P060-2CS121Y feature comparison

A3P060-2TQG144YI Microsemi FPGA & SoC

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A3P060-2CS121Y Microsemi Corporation

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI SOC PRODUCTS GROUP MICROSEMI CORP
Part Package Code QFP
Package Description LFQFP, VFBGA,
Pin Count 144
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G144 S-PBGA-B121
Length 20 mm 6 mm
Moisture Sensitivity Level 3
Number of CLBs 1536 1536
Number of Equivalent Gates 60000 60000
Number of Terminals 144 121
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1536 CLBS, 60000 GATES 1536 CLBS, 60000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP VFBGA
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 1.6 mm 0.99 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD BOTTOM
Width 20 mm 6 mm
Base Number Matches 3 3
Rohs Code No
Package Equivalence Code BGA121,11X11,20

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