A3P060-2FGG144I
vs
A3P060-1TQG144Y
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
LBGA,
20 X 20 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, GREEN, TQFP-144
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Microsemi Corporation
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B144
S-PQFP-G144
JESD-609 Code
e1
Length
13 mm
20 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1536
1536
Number of Equivalent Gates
60000
60000
Number of Terminals
144
144
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1536 CLBS, 60000 GATES
1536 CLBS, 60000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LFQFP
Package Equivalence Code
BGA144,12X12,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
1.55 mm
1.6 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
13 mm
20 mm
Base Number Matches
4
2
Number of Inputs
91
Number of Outputs
91
Compare A3P060-2FGG144I with alternatives
Compare A3P060-1TQG144Y with alternatives