A3P060-2CS121Y
vs
A3P060-2TQG144
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
VFBGA,
|
20 X 20 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, GREEN, TQFP-144
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B121
|
S-PQFP-G144
|
Length |
6 mm
|
20 mm
|
Number of CLBs |
1536
|
1536
|
Number of Equivalent Gates |
60000
|
60000
|
Number of Terminals |
121
|
144
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
1536 CLBS, 60000 GATES
|
1536 CLBS, 60000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
LFQFP
|
Package Equivalence Code |
BGA121,11X11,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
0.99 mm
|
1.6 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Width |
6 mm
|
20 mm
|
Base Number Matches |
3
|
3
|
Clock Frequency-Max |
|
350 MHz
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
3
|
Number of Inputs |
|
91
|
Number of Outputs |
|
91
|
Packing Method |
|
TRAY
|
Qualification Status |
|
Not Qualified
|
Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare A3P060-2CS121Y with alternatives
Compare A3P060-2TQG144 with alternatives