A3P060-1TQG144
vs
A3P060-FGG144YI
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI SOC PRODUCTS GROUP
|
Package Description |
LFQFP,
|
LBGA,
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Microsemi Corporation
|
|
Clock Frequency-Max |
350 MHz
|
|
JESD-30 Code |
S-PQFP-G144
|
S-PBGA-B144
|
JESD-609 Code |
e3
|
e1
|
Length |
20 mm
|
13 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
1536
|
1536
|
Number of Equivalent Gates |
60000
|
60000
|
Number of Terminals |
144
|
144
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
1536 CLBS, 60000 GATES
|
1536 CLBS, 60000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
LBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.6 mm
|
1.55 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.5 mm
|
1 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Width |
20 mm
|
13 mm
|
Base Number Matches |
7
|
1
|
Part Package Code |
|
BGA
|
Pin Count |
|
144
|
Package Equivalence Code |
|
BGA144,12X12,40
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare A3P060-1TQG144 with alternatives
Compare A3P060-FGG144YI with alternatives