A3P060-1FG144YI vs A3P060-1FGG144T feature comparison

A3P060-1FG144YI Microsemi FPGA & SoC

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A3P060-1FGG144T Microchip Technology Inc

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Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI SOC PRODUCTS GROUP MICROCHIP TECHNOLOGY INC
Part Package Code BGA
Package Description LBGA, 1 MM PITCH, GREEN, FBGA-144
Pin Count 144
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.31.00.01
JESD-30 Code S-PBGA-B144 S-PBGA-B144
JESD-609 Code e0 e1
Length 13 mm 13 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1536 1536
Number of Equivalent Gates 60000 60000
Number of Terminals 144 144
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1536 CLBS, 60000 GATES 1536 CLBS, 60000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 1.55 mm 1.55 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD SILVER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 13 mm
Base Number Matches 1 1
Rohs Code Yes
ECCN Code EAR99
Clock Frequency-Max 350 MHz
Number of Inputs 96
Number of Logic Cells 1536
Number of Outputs 96
Package Equivalence Code BGA144,12X12,40
Packing Method TRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Screening Level AEC-Q100
Time@Peak Reflow Temperature-Max (s) 30

Compare A3P060-1FG144YI with alternatives

Compare A3P060-1FGG144T with alternatives