Findchips: Compare A3P060-1CSG121YI vs A3P060-2QN132II

A3P060-1CSG121YI vs A3P060-2QN132II feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	MICROSEMI CORP	MICROSEMI CORP
Package Description	VFBGA,	VBCC,
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01	8542.39.00.01
JESD-30 Code	S-PBGA-B121	S-XBCC-B132
Length	6 mm	8 mm
Moisture Sensitivity Level	3
Number of CLBs	1536	1536
Number of Equivalent Gates	60000	60000
Number of Terminals	121	132
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Organization	1536 CLBS, 60000 GATES	1536 CLBS, 60000 GATES
Package Body Material	PLASTIC/EPOXY	UNSPECIFIED
Package Code	VFBGA	VBCC
Package Equivalence Code	BGA121,11X11,20
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	CHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Cel)	260
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max	0.99 mm	0.8 mm
Supply Voltage-Max	1.575 V	1.575 V
Supply Voltage-Min	1.425 V	1.425 V
Supply Voltage-Nom	1.5 V	1.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL
Terminal Form	BALL	BUTT
Terminal Pitch	0.5 mm	0.5 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30
Width	6 mm	8 mm
Base Number Matches	1	1
Clock Frequency-Max		350 MHz
Qualification Status		Not Qualified
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays