A3P030-QNG68YI
vs
A3PN030-ZQN48I
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI SOC PRODUCTS GROUP
MICROSEMI CORP
Part Package Code
QFP
Package Description
VQCCN,
HQCCN,
Pin Count
68
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-XQCC-N68
S-XQCC-N48
Length
8 mm
6 mm
Moisture Sensitivity Level
3
Number of CLBs
768
768
Number of Equivalent Gates
30000
30000
Number of Terminals
68
48
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
768 CLBS, 30000 GATES
768 CLBS, 30000 GATES
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
VQCCN
HQCCN
Package Equivalence Code
LCC68,.32SQ,16
LCC48,.24SQ,16
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
1 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.4 mm
0.4 mm
Terminal Position
QUAD
QUAD
Width
8 mm
6 mm
Base Number Matches
1
1
Rohs Code
Peak Reflow Temperature (Cel)
235
Qualification Status
Not Qualified
Time@Peak Reflow Temperature-Max (s)
20
Compare A3P030-QNG68YI with alternatives
Compare A3PN030-ZQN48I with alternatives