A3979SLP
vs
A3977EED
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ALLEGRO MICROSYSTEMS LLC
|
ALLEGRO MICROSYSTEMS LLC
|
| Part Package Code |
TSSOP
|
LCC
|
| Package Description |
HTSSOP, TSSOP28,.25
|
COPPER BATWING, PLASTIC, LCC-44
|
| Pin Count |
28
|
44
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Allegro Microsystems
|
|
| Additional Feature |
ALSO REQUIRES 8V TO 35V VBB SUPPLY
|
|
| Analog IC - Other Type |
STEPPER MOTOR CONTROLLER
|
STEPPER MOTOR CONTROLLER
|
| JESD-30 Code |
R-PDSO-G28
|
S-PQCC-J44
|
| JESD-609 Code |
e0
|
e0
|
| Length |
9.7 mm
|
16.5862 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
44
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-40 °C
|
| Output Current-Max |
2.5 A
|
2.5 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTSSOP
|
QCCJ
|
| Package Equivalence Code |
TSSOP28,.25
|
LDCC44,.7SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
4.57 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BCDMOS
|
NMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
4.4 mm
|
16.5862 mm
|
| Base Number Matches |
1
|
1
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare A3979SLP with alternatives
Compare A3977EED with alternatives