A2F200M3F-FGH256Y
vs
A2F200M3F-FGG256YI
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
ACTEL CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
1 MM PITCH, HALOGEN FREE, FBGA-256
|
17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256
|
Reach Compliance Code |
unknown
|
compliant
|
Clock Frequency-Max |
80 MHz
|
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
Length |
17 mm
|
17 mm
|
Number of CLBs |
4608
|
|
Number of Equivalent Gates |
200000
|
200000
|
Number of Inputs |
66
|
117
|
Number of Logic Cells |
4608
|
4608
|
Number of Outputs |
66
|
117
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
85 °C
|
100 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
4608 CLBS, 200000 GATES
|
200000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LFBGA
|
Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FPGA SOC
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.7 mm
|
1.7 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
2
|
3
|
HTS Code |
|
8542.31.00.01
|
|
|
|