A2F200M3F-FG256I
vs
A2F200M3E-1FG256YC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI SOC PRODUCTS GROUP
Package Description
17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256
,
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
16 Weeks
JESD-30 Code
S-PBGA-B256
Length
17 mm
Number of Equivalent Gates
200000
Number of Inputs
117
Number of Logic Cells
4608
Number of Outputs
117
Number of Terminals
256
Operating Temperature-Max
100 °C
Operating Temperature-Min
-40 °C
Organization
200000 GATES
Package Body Material
PLASTIC/EPOXY
Package Code
LFBGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
Programmable Logic Type
FPGA SOC
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
1.7 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.425 V
Supply Voltage-Nom
1.5 V
Surface Mount
YES
Technology
CMOS
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
17 mm
Base Number Matches
3
2
JESD-609 Code
e0
Moisture Sensitivity Level
3
Terminal Finish
TIN LEAD
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