A2F200M3E-1FGG256YC
vs
A2F200M3E-1FGG256YI
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
,
|
1 MM PITCH, GREEN, FBGA-256
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-609 Code |
e1
|
e1
|
| Moisture Sensitivity Level |
3
|
3
|
| Peak Reflow Temperature (Cel) |
250
|
250
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FPGA SOC
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN SILVER COPPER
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| JESD-30 Code |
|
S-PBGA-B256
|
| Length |
|
17 mm
|
| Number of Equivalent Gates |
|
200000
|
| Number of Inputs |
|
117
|
| Number of Logic Cells |
|
4608
|
| Number of Outputs |
|
117
|
| Number of Terminals |
|
256
|
| Operating Temperature-Max |
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
200000 GATES
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
LBGA
|
| Package Equivalence Code |
|
BGA256,16X16,40
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY, LOW PROFILE
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.7 mm
|
| Supply Voltage-Max |
|
1.575 V
|
| Supply Voltage-Min |
|
1.425 V
|
| Supply Voltage-Nom |
|
1.5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
17 mm
|
|
|
|
Compare A2F200M3E-1FGG256YC with alternatives
Compare A2F200M3E-1FGG256YI with alternatives