Findchips: Compare A2F200M3E-1FG256YC vs A2F200M3E-1FG256Y

A2F200M3E-1FG256YC vs A2F200M3E-1FG256Y feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Transferred	Active
Ihs Manufacturer	MICROSEMI SOC PRODUCTS GROUP	MICROCHIP TECHNOLOGY INC
Package Description	,	1 MM PITCH, FBGA-256
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
JESD-609 Code	e0
Moisture Sensitivity Level	3	3
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FPGA SOC
Terminal Finish	TIN LEAD
Base Number Matches	1	2
Rohs Code		Yes
JESD-30 Code		S-PBGA-B256
Length		17 mm
Number of Equivalent Gates		200000
Number of Inputs		117
Number of Logic Cells		4608
Number of Outputs		117
Number of Terminals		256
Operating Temperature-Max		85 °C
Operating Temperature-Min
Organization		200000 GATES
Package Body Material		PLASTIC/EPOXY
Package Code		LBGA
Package Equivalence Code		BGA256,16X16,40
Package Shape		SQUARE
Package Style		GRID ARRAY, LOW PROFILE
Qualification Status		Not Qualified
Seated Height-Max		1.7 mm
Supply Voltage-Max		1.575 V
Supply Voltage-Min		1.425 V
Supply Voltage-Nom		1.5 V
Surface Mount		YES
Technology		CMOS
Temperature Grade		OTHER
Terminal Form		BALL
Terminal Pitch		1 mm
Terminal Position		BOTTOM
Width		17 mm
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays