A2F200M3E-1FG256I
vs
A2F200M3G-1FGG256YC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI SOC PRODUCTS GROUP
Package Description
1 MM PITCH, FBGA-256
,
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B256
Length
17 mm
Moisture Sensitivity Level
3
3
Number of Equivalent Gates
200000
Number of Inputs
117
Number of Logic Cells
4608
Number of Outputs
117
Number of Terminals
256
Operating Temperature-Max
100 °C
Operating Temperature-Min
-40 °C
Organization
200000 GATES
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
Programmable Logic Type
FPGA SOC
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
1.7 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.425 V
Supply Voltage-Nom
1.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
17 mm
Base Number Matches
3
2
JESD-609 Code
e1
Peak Reflow Temperature (Cel)
250
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
30
Compare A2F200M3E-1FG256I with alternatives
Compare A2F200M3G-1FGG256YC with alternatives