9FGL0241CKILF
vs
9FGL0251BKILFT
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
VFQFPN
|
VFQFPN
|
| Package Description |
VFQFPN-24
|
VFQFPN-24
|
| Pin Count |
24
|
24
|
| Manufacturer Package Code |
NLG24P1
|
NLG24S1
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2018-11-02
|
|
| JESD-30 Code |
S-XQCC-N24
|
S-XQCC-N24
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4 mm
|
4 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Clock Frequency-Max |
100 MHz
|
100 MHz
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC24,.16SQ,20
|
LCC24,.16SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Primary Clock/Crystal Frequency-Nom |
25 MHz
|
40 MHz
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Current-Max |
23 mA
|
30 mA
|
| Supply Voltage-Max |
3.465 V
|
3.465 V
|
| Supply Voltage-Min |
3.135 V
|
3.135 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN
|
TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
4 mm
|
4 mm
|
| uPs/uCs/Peripheral ICs Type |
CLOCK GENERATOR, PROCESSOR SPECIFIC
|
CLOCK GENERATOR, PCIe
|
| Base Number Matches |
2
|
1
|
| Additional Feature |
|
PCIe Generation 1,2,3,4
|
| Package Body Material |
|
UNSPECIFIED
|
| Technology |
|
CMOS
|
|
|
|
Compare 9FGL0241CKILF with alternatives
Compare 9FGL0251BKILFT with alternatives