97ULP877BHLF
vs
IDTCSPUA877ABVG
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
CABGA
BGA
Package Description
GREEN, PLASTIC, MO-205, MO-225, FBGA-52
GREEN, VFBGA-52
Pin Count
52
52
Manufacturer Package Code
BVG52
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
97ULP
CSPUA877
Input Conditioning
DIFFERENTIAL
DIFFERENTIAL
JESD-30 Code
R-PBGA-B52
R-PBGA-B52
JESD-609 Code
e1
e1
Length
7 mm
7 mm
Logic IC Type
PLL BASED CLOCK DRIVER
PLL BASED CLOCK DRIVER
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Inverted Outputs
Number of Terminals
52
52
Number of True Outputs
10
10
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
VFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Same Edge Skew-Max (tskwd)
0.04 ns
0.04 ns
Seated Height-Max
1 mm
1 mm
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
BOTTOM
BOTTOM
Width
4.5 mm
4.5 mm
fmax-Min
350 MHz
410 MHz
Base Number Matches
2
2
Max I(ol)
0.009 A
Package Equivalence Code
BGA52,6X10,25
Technology
CMOS
Time@Peak Reflow Temperature-Max (s)
30
Compare 97ULP877BHLF with alternatives
Compare IDTCSPUA877ABVG with alternatives