97U877AHLF vs ICS98ULPA877AKI-T feature comparison

97U877AHLF Integrated Device Technology Inc

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ICS98ULPA877AKI-T Integrated Device Technology Inc

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code CABGA DFN
Package Description PLASTIC, VFBGA-52 PLASTIC, MLF-40
Pin Count 52 40
Manufacturer Package Code BVG52 MLF
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 97U 98ULPA
Input Conditioning DIFFERENTIAL DIFFERENTIAL
JESD-30 Code R-PBGA-B52 S-PQCC-N40
JESD-609 Code e1 e0
Length 7 mm 6 mm
Logic IC Type PLL BASED CLOCK DRIVER PLL BASED CLOCK DRIVER
Max I(ol) 0.009 A
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Inverted Outputs
Number of Terminals 52 40
Number of True Outputs 10 10
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA HVQCCN
Package Equivalence Code BGA52,6X10,25
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Same Edge Skew-Max (tskwd) 0.04 ns 0.04 ns
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 4.5 mm 6 mm
fmax-Min 350 MHz 410 MHz
Base Number Matches 1 2

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