93LCS66-I/P
vs
24LC16BI/SL
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
DIP
|
SOIC
|
Package Description |
DIP, DIP8,.3
|
0.150 INCH, PLASTIC, SOIC-14
|
Pin Count |
8
|
14
|
Reach Compliance Code |
unknown
|
compliant
|
Additional Feature |
100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS
|
|
Clock Frequency-Max (fCLK) |
2 MHz
|
0.1 MHz
|
Data Retention Time-Min |
200
|
200
|
Endurance |
1000000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G14
|
JESD-609 Code |
e0
|
e3
|
Length |
9.46 mm
|
9.271 mm
|
Memory Density |
4096 bit
|
16384 bit
|
Memory IC Type |
EEPROM
|
EEPROM
|
Memory Width |
16
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
14
|
Number of Words |
256 words
|
2048 words
|
Number of Words Code |
256
|
2000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
256X16
|
2KX8
|
Output Characteristics |
3-STATE
|
OPEN-DRAIN
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SOP
|
Package Equivalence Code |
DIP8,.3
|
SOP14,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Power Supplies |
3/5 V
|
3/5 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.32 mm
|
1.728 mm
|
Serial Bus Type |
MICROWIRE
|
I2C
|
Standby Current-Max |
0.00003 A
|
0.00003 A
|
Supply Current-Max |
0.003 mA
|
0.003 mA
|
Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Matte Tin (Sn)
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
Width |
7.62 mm
|
3.9 mm
|
Write Cycle Time-Max (tWC) |
10 ms
|
10 ms
|
Write Protection |
HARDWARE/SOFTWARE
|
HARDWARE
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
I2C Control Byte |
|
1010MMMR
|
Moisture Sensitivity Level |
|
1
|
|
|
|
Compare 93LCS66-I/P with alternatives
Compare 24LC16BI/SL with alternatives