93LC66BI/P
vs
CAT24C21L
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
ON SEMICONDUCTOR
Part Package Code
DIP
DIP
Package Description
0.300 INCH, LEAD FREE, PLASTIC, MS-001, DIP-8
DIP,
Pin Count
8
8
Reach Compliance Code
compliant
compliant
Alternate Memory Width
8
Clock Frequency-Max (fCLK)
2 MHz
0.4 MHz
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e3
e3
Length
9.46 mm
9.59 mm
Memory Density
1024 bit
1024 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
128 words
128 words
Number of Words Code
128
128
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128X8
128X8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.32 mm
4.57 mm
Serial Bus Type
MICROWIRE
I2C
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.8 V
2.5 V
Supply Voltage-Nom (Vsup)
2.5 V
3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
7.62 mm
Write Cycle Time-Max (tWC)
6 ms
5 ms
Base Number Matches
1
2
ECCN Code
EAR99
HTS Code
8542.32.00.51
Compare 93LC66BI/P with alternatives
Compare CAT24C21L with alternatives