93LC66B-I/PD22 vs 93LC66BT-E/P feature comparison

93LC66B-I/PD22 Microchip Technology Inc

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93LC66BT-E/P Microchip Technology Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Additional Feature 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS
Clock Frequency-Max (fCLK) 1 MHz 2 MHz
Data Retention Time-Min 200
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e3 e3
Length 9.27 mm 9.46 mm
Memory Density 4096 bit 1024 bit
Memory IC Type EEPROM EEPROM
Memory Width 16 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 256 words 128 words
Number of Words Code 256 128
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256X16 128X8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.33 mm 4.32 mm
Serial Bus Type MICROWIRE MICROWIRE
Supply Current-Max 0.002 mA 0.003 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.8 V 1.8 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Write Cycle Time-Max (tWC) 6 ms 6 ms
Base Number Matches 1 1
Alternate Memory Width 8
Screening Level AEC-Q100

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